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M4841
Dynamic Test Handler
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs

Today's semiconductors are gaining in complexity both in circuit design and packaging, and continue to be challenged by high-volume applications that function in environments with wide-ranging temperature fluctuations. Semiconductor test and handling equipment must evolve to meet these requirements, in the same way it must adapt to increasing demands for higher parallelism and higher throughput.


Unique in its class, Advantest's new M4841 Dynamic Test Handler enables high-throughput parallel test for very high volumes of devices and supports complex ICs and packages, including BGA, CSP and QFP. Because of its advanced performance capabilities and features, the M4841 is the optimal dynamic test handler for high volume production of devices used in consumer products such as portable digital equipment and automotive systems.

Reduced Cost of Test

The M4841 is capable of parallel test of up to 16 devices, double the capability of the earlier, industry-leading handler, also from Advantest. The M4841 also delivers a high throughput of 18,500 devices per hour. With three times the throughput capacity of its predecessor, the M4841 sets a new standard for the industry. Because of its high test efficiency, the M4841 is well-suited for high-volume production lines. With its unprecedented combination of 16-device parallel test and 18,500 device-per-hour throughput at 3 seconds test time or less, the M4841 makes a substantial contribution to reduced cost of test.

Supports Test Across Wide Temperature Range

The M4841 maintains a constant temperature and devices can be cooled to -40 or heated to 125. This wide temperature range ensures that the M4841 can be used to simulate device application environments with severe temperature ranges, such as those experienced in automotive or avionics. By minimizing the effects of heating or cooling upon throughput, the M4841 offers consistently high speeds and performance, even at temperature extremes.

Major Specifications
Target Packages BGA, CSP, QFP, etc.
Simultaneous Testing Up to 16 devices
Throughput 18,500 devices per hour
Temperature Range -40 to +125
IC Test System
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