Yield improvement by optimized thermal control
Because new generation devices continue the trend of higher speed data transmission, such as DDR, their heat dissipation and thermal management becomes a significant test consideration. Our Thermal Compensation Technology effectively manages the device's temperature even in a highly simultaneous test environment. In addition to greater temperature accuracy (which leads to improved yields) the soak times are shortened resulting in a productivity increase.

Optimized handling for light and small devices
For conveyance of the memory device which is becoming smaller and lighter, such as a CSP package, the new handling system and a new mechanism have been adopted. Optimal handling is attained and improvement in productivity is realized without giving a movement shock to delicate devices. Moreover, in order to realize high speed and low vibration, a low center-of-gravity arm structure was implemented which further reduced handling times and improved operational stability.

Improved maintenance by easy operation
Easy and quick operation is provided through a simple touch panel and large display. In addition, real pictures and graphical screens improve the thoroughness and convenience of Help and maintenance functions.

Diversity of function and option
The M6542AD includes an array of diverse functions which optimize customers' test environment and facilitate using handlers in ramping devices and in taking correlation data. An automatic re-inspection function, a socket sequence correlation function, optional auto category expansion unit, optional auto loader expansion unit, and numerous other functions are available.