On June 26, 2008，Shenzhen IC Design Incubation Co., Ltd. and Advantest (Suzhou) Co., Ltd. Will cooperate to offer you the design and testing total solution for Communication/mobile ICs.

Time： 13：30 ~ 17：00 PM , June 26, 2008;  Friday

Place：Training Room, Futian Design Garden, Shenzhen IC Design
             Industrial Center Room 307, Building A, Tian’anshuma Science
             Mansion, Futian Section, Shenzhen
             (Crossing of Xiangmihu Road and Shennan Road)

Agenda：      

       A. Open Ceremony of Futian Design Garden DSP Design Lab   

       B. Communication/mobile ICs Design & Testing Seminar

       （1）Latest ATE testing for Communication/Mobile IC

              - Power Management / LCD Dr./ Multi-media / RF / Baseband ICs

              - The latest Status of ATE Testing 

       （2）Baseband Chipset Trend & Test Requirements

              - Baseband Chipset Trend

              - baseband IC testing challenges

              - Baseband IC test requirements and solutions              

       （3）Latest RF IC Testing Technology

              - RF IC Trend

              - RF IC testing challenges

              - RF IC test requirements and solutions             

       （4）T2000-ATE testing solutions for Communication/mobile ICs

              - T2000GSMF Introduction

              - Introduction of diverse modules

              - Service Introduction 

       （5）Cadence Allegro application in High End Mobile

              - Mobile Design Trend

              - SiP Application Trend and Forecast

              - FPGA Timing Design technique

              - How to combine RF Design and PCB Design

              - Mobile phone application circuitry :t Design- simulation-
                implementation

 

Communication/Mobile IC Testing Experts from Japan will share the latest high end RF Testing Technology with you!