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Increasing functionality of cell phones
and mobile devices, such as the more sophisticated
features found in high-definition cameras and built-in
music players, is driving the development of memory
devices with expanded capacity, functionality and speed.
This trend is propelling the growth of MCPs (multi chip
packages), which combine multiple memory chips - such as
NAND, NOR and SDRAM - in a single package. The T5781
addresses the needs of these new, memory intensive
applications, and offers a cost-effective, high volume
production test solution.
Up to 512 device parallel test
Taking advantage of the per-site architecture optimized
for MCP and flash memory tests, the T5781 enables a
parallel test of up to 256 MCPs or 512 NAND flash
memories. The newly developed switch matrix and all I/O
pin architecture allow the system to support a HIFIX for
which pin resources can be optimized and shared when
testing various types of MCPs. Furthermore, the DRAM
test function allows the system to support not only a
flash memory test but also a wide variety of DRAM tests.
T5781ES for evaluation and test
program development
The newly developed T5781ES engineering station
integrates all of the functions and performance of the
T5781 into a very compact footprint, offering low costs
for both test program development, and device evaluation
and analysis. This contributes to a reduction of turn
around time taken from the development of new devices to
their mass production.
Using FutureSuiteŽ, with
multi-language support
FutureSuite software allows program development as well
as device evaluation and analysis by maximizing the
functionality of the per-site architecture. It delivers
full support from the design of new devices to their
mass production. The software also allows programming in
both MCI (C language) and ATL languages. | 
